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Flip chip packaging
| Глоссарий ИТ-терминов |
A packaging technique that connects die bond pads to a package substrate without using wire bonds. the bumped die is placed on the package substrate where the bumps connect to the package pins.
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Comp-3, английский
A packed decimal data type that specifies internal decimal items stored in packed decimal format. in the packed decimal format, each byte in a field represents two numeric digits except for the rightmost byte. the rightmost byte holds one digit and the sign.
Service package, английский
A package, also known as a service template, is a file that contains the role binaries and the service definition file to be published to the microsoft azure fabric.
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